OtherClosing soon
Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION › NASA SHARED SERVICES CENTER
Response deadlineAug 12, 2026 4:00 PM EDT
View official notice on SAM.gov (opens in a new tab)
Verify before acting. Users must verify deadlines, amendments, attachments, eligibility, and submission requirements on the official SAM.gov notice. Read the Data Disclaimer.
Key decision factors
- Response deadline
- Aug 12, 2026 4:00 PM EDT
- Posted
- Aug 10, 2026 12:00 AM EDT
- Notice type
- Special Notice
- Set-aside
- Not provided or not applicable
- NAICS
- 813920
- PSC
- 6099
- Place of performance
- Not specified
- Current status
- Closing soon
Notice details
- Official status
- Closing soon
- Normalized group
- Other
- Notice ID
- 9517449fa10b4afd8b72b245d5a29ed8
- Solicitation number
- 80NSSC26939631Q
Description
Full description is not currently available in MaroNest. Review the official SAM.gov notice for complete requirements.
Attachments
1 attachment reported by SAM.gov
Files are hosted by SAM.gov. Open the official notice to review and download them.
Contacts
kacey Hickman
Primary
kacey.l.hickman@nasa.govWill Garrett
Secondary
will.c.garrett@nasa.govPersonalized relevance
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